Compal Electronics (hereinafter referred to as Compal; Stock Ticker: 2324.TW), a leading server solution provider, is excited to participate in the Intel Data Center & AI day on December 3rd, where it will showcase its latest server products—the SR230-2 and SD230-8. These servers combine exceptional computing power with flexible configuration options, designed to meet the evolving demands of both current and future data centers. With superior performance, scalability, and maintainability, they provide outstanding support for high-performance computing (HPC) and AI workloads.

As AI applications continue to grow, training large language models (LLMs) with GPUs poses challenges related to scalability and significant energy consumption. In contrast, CPUs offer greater efficiency and cost-effectiveness, making them the ideal choice for smaller language models (SMLs) and tasks such as data preparation, transferring data to GPUs for parallel processing, and memory management. The SR230-2 and SD230-8 servers, powered by Intel® Xeon® 6 processors, feature a dual-architecture design with Efficient-cores (E-cores) and Performance-cores (P-cores). The E-cores deliver excellent performance per watt, while the P-cores provide optimal performance for a wide range of workloads, including AI and HPC applications.

SR230-2 2U 2P General-Purpose Server Platform

The SR230-2 is a powerful and future-ready server, equipped with up to 128 processor cores and delivering up to 5x improved AI inferencing performance. with high maximum turbo frequencies, it accelerates model training times, while its up to 504MB L3 cache ensures low latency and quick access to essential libraries, optimizing task processing.

SD230-8 2U 4-Node High-Density Server Platform

Designed for high-density, space-saving data centers, the SD230-8 delivers up to 2x better HPC performance and incorporates MRDIMM technology, resulting in up to 5.5x better AI inferencing performance. Additionally, it features Intel Advanced Matrix Extensions (AMX), which enhances deep learning, training, and inferencing performance, particularly for natural language processing (NLP), recommendation systems, and image recognition tasks.

Both servers, whether the single-node high-performance computing of the SR230-2 or the multi-node high-density design of the SD230-8, offer exceptional flexibility, scalability, and performance, making them ideal for meeting the diverse needs of today’s and tomorrow’s data centers. Their impressive AI inferencing, HPC, and energy efficiency capabilities will drive digital transformation and improve operational efficiency for enterprises.

Compal looks forward to showcasing these innovative server solutions at Intel Data Center and AI day, where it will engage with industry professionals to explore how these advanced server technologies can accelerate digital transformation, enhance operational efficiency, and create more value for businesses in the future

About Compal

Founded in 1984, Compal is a leading manufacturer in the notebook and smart device industry, creating brand value in collaboration with various sectors. Through continuous innovation and forward-thinking, the company realizes smart technology and provides high-quality service based on extensive industry experience. Its groundbreaking product designs have received numerous international awards. In 2023, Compal was recognized by CommonWealth Magazine as one of Taiwan's top 6 manufacturers and has consistently ranked among the Forbes Global 2000 and Fortune Global 500 companies. In recent years, Compal has actively developed emerging businesses, including cloud servers, auto electronics, and smart medical, leveraging its integrated hardware and software R&D and manufacturing capabilities to create relevant solutions. More information on Compal server, please visit https://www.compalserver.com/

Media Contact

Jack Wang         Vice president and Spokesperson     +886-2-8797-8588      Investor@compal.com