Compal Electronics (Compal; TWSE: 2324), a global leader in technology innovation and system integration, showcased its next-generation enterprise AI computing platforms at AMD Advancing AI 2026 in San Francisco (Booth #135). Featuring platforms powered by AMD EPYC™ 9006 Series processors and AMD Instinct™ accelerators, Compal demonstrates its continued commitment to delivering AI-ready infrastructure with high performance, thermal innovation, and deployment flexibility. These solutions are designed to help customers address rapidly evolving AI workloads while accelerating data center modernization.
As enterprise AI continues to move from experimentation to production, organizations require infrastructure capable of supporting increasingly complex AI services, business-critical workloads and general-purpose computing. Beyond compute performance, modern AI deployments demand greater scalability, higher I/O bandwidth, improved GPU utilization and operational efficiency. Platforms featuring 6th Gen AMD EPYC Server processors serve as ideal AI host nodes, supporting enterprise AI, cloud, high-performance computing (HPC), virtualization and general-purpose workloads across the modern data center.
To address diverse AI computing requirements, Compal will showcase two next-generation server platforms. The SR231-1A supports up to 256 cores and 512 threads with 6th Gen AMD EPYC™ Server processors, paired with AMD Instinct™ MI350P PCIe® Cards, and is purpose-built for high-performance computing (HPC), cloud and AI workloads. The platform supports PCIe® Gen 6, delivering up to 2x bandwidth per link compared to the previous generation to significantly enhance high-speed data throughput. Combined with an advanced cooling architecture and optimized thermal design, the SR231-1A enables stable, reliable operation while meeting the performance demands of high-density AI computing environments.
Compal will also showcase the SG520-2A-L1, supporting AMD Instinct™ MI355X GPUs and engineered for next-generation AI computing. Designed with an optimized 850 mm chassis depth for seamless integration into standard EIA 19-inch rack environments, the platform combines a highly modular, tool-less mechanical architecture that simplifies service operations, reduces maintenance downtime and accelerates system upgrade efficiency. Support for direct liquid cooling (DLC) further enhances thermal efficiency, enabling higher rack density and improved performance for demanding AI workloads.
In addition to its product showcase at Booth #135, Compal will participate in the official AMD Advancing AI 2026 Theater Session titled "One Ecosystem, Infinite Scale: AI at Every Scale." During the presentation, Compal will share how integrated CPU, GPU, networking and system architectures enable scalable AI infrastructure from individual nodes to rack-scale deployments while supporting an open AI ecosystem across diverse enterprise applications.
By continuing its collaboration with AMD, Compal delivers enterprise AI, cloud and HPC solutions that combine the strengths of 6th Gen AMD EPYC™ Server processors and AMD Instinct™ accelerators. Together, these solutions help customers build modern data centers with high performance, energy efficiency and long-term scalability, providing a strong foundation for enterprise AI at scale.
AMD, the AMD Arrow logo, EPYC, AMD Instinct, and the combination thereof are trademarks of Advanced Micro Devices, Inc.
About Compal
Founded in 1984, Compal is a leading manufacturer in the notebook and smart device industry, creating brand value in collaboration with various sectors. Its groundbreaking product designs have received numerous international awards. In 2025, Compal was recognized by CommonWealth Magazine as one of Taiwan's top 7 manufacturers and has consistently ranked among the Forbes Global 2000 companies. In recent years, Compal has actively developed emerging businesses, including cloud servers, auto electronics, and smart medical, leveraging its integrated hardware and software R&D and manufacturing capabilities to create relevant solutions. More information, please visit https://www.compal.com
Media Contact
Jack Wang Vice president and Spokesperson +886-2-8797-8588 Investor@compal.com