NXP Powers Compal’s New Integrated Small Cell Solution to Address 5G Network Densification

NXP^®Semiconductors (NASDAQ: NXPI) today announced that NXP’s Layerscape^® and Layerscape Access family of processors have been chosen by Compal Electronics, one of the world's largest ODMs, to power its new 5G Integrated Small Cell (ISC) solution. Designed to enhance 5G networks density, the new solution delivers high performance capabilities based on a 4-antenna configuration to enable new 5G use cases. These include smart cities and factories, enhanced indoor 5G coverage, and low-latency applications, across public and private networks.

5G network signals attenuate quickly, particularly through walls or over long distances. Small cells are required to boost the network signal so that coverage can be extended to indoor spaces or throughout dense urban areas. The Compal ISC solution delivers the high performance needed to enhance network density, while also delivering the low latency performance users expect from a 5G connection.

The Compal ISC solution leverages the NXP Layerscape portfolio, including Layerscape multi-core processors and Layerscape Access LA1200 programmable baseband processor. The Layerscape multicore processors provide high levels of integration and leverage Arm 64-bit cores, while the Layerscape Access programmable baseband processors provide unprecedented flexibility via programmable engines for PHY/baseband processing. The overall system delivers efficient, scalable performance exceeding 1Gbps data rates via software-defined radio implementation.

The Compal ISC solution, powered by NXP’s software programable modem is scheduled for deployment in the Asia New Bay Area in Kaohsiung, Taiwan for its 5G Innovation Lab, which is focused on the implementation of R&D results by conducting field validation and promoting commercialization. It is planned to be deployed in Japan in the second half of 2022.