FAQs

Technically yes, but practically no.

USB 2.0 is capped at 480 Mbps. Since 5G can exceed 2,000 Mbps (2 Gbps), your module will be bored while your data interface is "choking."

Recommendation:
Use USB 3.1 Gen 2 or PCIe Gen 3/4. If your host processor (like an older MCU) only has USB 2.0, you are wasting the cost and power of a 5G module.

RedCap modules need 1 or 2 antenna depends on supporting chipset.

LGA: Solder-down modules. Best for high-vibration environments (automotive, industrial) and high-volume production.
They offer better thermal dissipation as the module is directly coupled to the PCB.

M.2: Plug-and-play cards. Best for laptops, gateways, and lower-volume products.
They are easier to swap for upgrades but require more vertical space and a connector (M.2 Key B is standard for 5G).

Thermal Design Recommendations:

Thermal Vias: *
The large GND pads under the module are the primary path for heat dissipation.
Your PCB design should include a dense array of Thermal Vias connecting these pads to the inner and bottom copper layers of the motherboard.

Thermal Interface Material (TIM): *
For high-throughput applications (like 5G routers or gateways), use a Thermal Pad or Thermal Glue to bridge the gap between the module’s metal shielding case and a heatsink or the device's metal chassis.

Software Monitoring: *
You can monitor the internal temperature via AT commands to adjust cooling or workload dynamically: * Command: AT*CTHERINFO=?

Hardware Checkpoints:

1. VBAT Voltage Drop: *
Use an oscilloscope to measure the VBAT pins. Ensure that even during peak bursts, the voltage never drops below the module's minimum operating threshold (typically 3.3V).

2. Capacitor Placement: *
Place large-capacity capacitors (e.g., low-ESR tantalum or polymer capacitors) as close to the VBAT pins as possible to act as a local energy reservoir.

3. Trace Width: *
The PCB trace for VBAT should be at least 2mm to 3mm wide (or use a dedicated power plane) to minimize impedance and handle high current flow.

Refer to the datasheet.

Please check module AT command document.

Adb reboot edl

Common Debugging Steps & AT Commands:
1. Check SIM Status:
Command: AT+CPIN?
Goal: Ensure it returns +CPIN: READY. If it returns SIM NOT INSERTED, check the physical slot or voltage levels.

2. Check Signal Quality:
Command: AT+CESQ=?
Goal: Ensure the signal is strong enough. For 5G, RSRP should ideally be better than -105 dBm.

3. Check Network Registration Status:
Command: AT+CEREG?
Status Codes: Look for ,1 (Registered, home network) or ,5 (Registered, roaming). If it returns ,0 or ,2, the module is searching but failing to attach.

4. Verify APN Configuration:
Command: AT+CGDCONT?
Goal: Confirm the Access Point Name (APN) matches your carrier’s requirements for 5G data.

Our module provides the drivers and instructions for Windows, Linux.
Please contact our sales representative for details.

This is often a software configuration issue rather than a signal problem:

• USB 2.0 vs 3.1: Ensure your kernel is using the USB 3.1 SuperSpeed drivers.

• MTU Size: 5G handles large packets. If your MTU is set to the default 1500, you may experience fragmentation. Some 5G networks perform better with an MTU of 1600 or higher.

• CPU Bottleneck: On low-power ARM devices (like a Raspberry Pi), the CPU might hit 100% just processing the high-speed Ethernet-over-USB packets.